A signal processing method for the friction-based endpoint detection system of a CMP process

作     者：徐驰 郭东明 金洙吉 康仁科 

作者机构：Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of EducationDalian University of Technology 

出 版 物：《Journal of Semiconductors》 (半导体学报（英文版）)

年 卷 期：2010年第31卷第12期

页      面：138-142页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：Project supported by the Major Program of National Natural Science Foundation of China(No.50390061) the National Science and Technology Major Project,China(No.2009ZX02011) 

主　　题：CMP endpoint detection signal processing 

摘      要：A signal processing method for the friction-based endpoint detection system of a chemical mechanical polishing （CMP） process is presented. The signal process method uses the wavelet threshold denoising method to reduce the noise contained in the measured original signal, extracts the Kalman filter innovation from the denoised signal as the feature signal, and judges the CMP endpoint based on the feature of the Kalman filter innovation sequence during the CMP process. Applying the signal processing method, the endpoint detection experiments of the Cu CMP process were carried out. The results show that the signal processing method can judge the endpoint of the Cu CMP process.