High heat loading performance of actively cooled W/Cu FGM-based components

作     者：Zhang-jian Zhou Jun Tan Dan-dan Qu Hua Li Young-jin yum Hyun-woo Lim 

作者机构：School of Materials Science and Engineering University of Science and Technology Beijing Beijing 100083 China Electronic Engineering Institute Hefei 230037 China School of Mechanical ＆ Automotive Engineering University of Ulsan Ulsan 680-749 Korea 

出 版 物：《International Journal of Minerals,Metallurgy and Materials》 (矿物冶金与材料学报（英文版）)

年 卷 期：2011年第18卷第4期

页      面：467-471页

核心收录：

学科分类：0709[理学-地质学] 0819[工学-矿业工程] 08[工学] 0806[工学-冶金工程] 0708[理学-地球物理学] 080104[工学-工程力学] 0815[工学-水利工程] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 0703[理学-化学] 0802[工学-机械工程] 0801[工学-力学（可授工学、理学学位）] 0702[理学-物理学] 

基　　金：supported by the National Natural Science Foundation of China (No.10805073) the National Magnetic Confinement Fusion Program of China (No.2010GB109000) 

主　　题：tungsten copper functionally graded materials thermal load 

摘      要：A functionally graded material-based actively water-cooled tungsten-copper mockup with a dimension of 30 mm×30 mm×25 mm was designed and fabricated by infiltration-brazing *** thicknesses of the pure W layer and W/Cu graded layer were 2 and 3 mm,*** heat flux tests were performed on the mockup using an e-beam *** is no damage occurring on the joint after heat loading at 5 MW/*** temperature on the pure W surface is less than 500°C after irradiation for 100 s at 5 MW/m2,while the temperature on the brazing seam/copper surface is around 200°C.