High heat loading performance of actively cooled W/Cu FGM-based components
High heat loading performance of actively cooled W/Cu FGM-based components作者机构:School of Materials Science and Engineering University of Science and Technology Beijing Beijing 100083 China Electronic Engineering Institute Hefei 230037 China School of Mechanical & Automotive Engineering University of Ulsan Ulsan 680-749 Korea
出 版 物:《International Journal of Minerals,Metallurgy and Materials》 (矿物冶金与材料学报(英文版))
年 卷 期:2011年第18卷第4期
页 面:467-471页
核心收录:
学科分类:0709[理学-地质学] 0819[工学-矿业工程] 08[工学] 0806[工学-冶金工程] 0708[理学-地球物理学] 080104[工学-工程力学] 0815[工学-水利工程] 0805[工学-材料科学与工程(可授工学、理学学位)] 080502[工学-材料学] 0703[理学-化学] 0802[工学-机械工程] 0801[工学-力学(可授工学、理学学位)] 0702[理学-物理学]
基 金:supported by the National Natural Science Foundation of China (No.10805073) the National Magnetic Confinement Fusion Program of China (No.2010GB109000)
主 题:tungsten copper functionally graded materials thermal load
摘 要:A functionally graded material-based actively water-cooled tungsten-copper mockup with a dimension of 30 mm×30 mm×25 mm was designed and fabricated by infiltration-brazing *** thicknesses of the pure W layer and W/Cu graded layer were 2 and 3 mm,*** heat flux tests were performed on the mockup using an e-beam *** is no damage occurring on the joint after heat loading at 5 MW/*** temperature on the pure W surface is less than 500°C after irradiation for 100 s at 5 MW/m2,while the temperature on the brazing seam/copper surface is around 200°C.