Surface shape control of the workpiece in a double-spindle triple-workstation wafer grinder

作     者：朱祥龙 康仁科 董志刚 冯光 

作者机构：Key Laboratory for Precision & Non-traditional Machining Technology of Ministry of EducationDalian University of Technology 

出 版 物：《Journal of Semiconductors》 (半导体学报（英文版）)

年 卷 期：2011年第32卷第10期

页      面：78-85页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：Project supported by the National High Technology Research and Development Program of China(No.2008AA042505) the National Science and Technology Key Project Program(No.2009ZX02011) the Natural Science Foundation of Guangdong Province,China (No.U0734008) 

主　　题：grinder silicon wafer surface shape control chuck dressing modeling 

摘      要：Double-spindle triple-workstation（DSTW） ultra precision grinders are mainly used in production lines for manufacturing and back thinning large diameter（≥300 mm） silicon wafers for integrated *** is important, but insufficiently studied,to control the wafer shape ground on a DSTW grinder by adjusting the inclination angles of the spindles and work *** this paper,the requirements of the inclination angle adjustment of the grinding spindles and work tables in DSTW wafer grinders are analyzed.A reasonable configuration of the grinding spindles and work tables in DSTW wafer grinders are *** on the proposed configuration,an adjustment method of the inclination angle of grinding spindles and work tables for DSTW wafer grinders is put forward. The mathematical models of wafer shape with the adjustment amount of inclination angles for both fine and rough grinding spindles are *** proposed grinder configuration and adjustment method will provide helpful instruction for DSTW wafer grinder design.