Antenna-in-package system integrated with meander line antenna based on LTCC technology

作     者：Gang DONG Wei XIONG Zhao-yao WU Yin-tang YANG 

作者机构：School of Microelectronics Xidian University 

出 版 物：《Frontiers of Information Technology & Electronic Engineering》 (信息与电子工程前沿（英文版）)

年 卷 期：2016年第17卷第1期

页      面：67-73页

核心收录：

学科分类：080904[工学-电磁场与微波技术] 0810[工学-信息与通信工程] 0808[工学-电气工程] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 0839[工学-网络空间安全] 0835[工学-软件工程] 0812[工学-计算机科学与技术（可授工学、理学学位）] 

基　　金：supported by the National Natural Science Foundation of China(Nos.61574106 and 61334003) the National Defense Pre-research Foundation of China(No.9140A23060115DZ01062) the Key Science and Technology Special Pro ject of Shaanxi Province,China(No.2015KTCQ01-5) 

主　　题：AntennaAn-package (AiP), Meander line antenna, Multi-chip module (MCM), Low temperature co-fired ceramic (LTCC) 

摘      要：We present an antenna-in-package system integrated with a meander line antenna based on low temperature co-fired ceramic(LTCC) technology. The proposed system employs a meander line patch antenna, a packaging layer, and a laminated multi-chip module(MCM) for integration of integrated circuit(IC) bare chips.A microstrip feed line is used to reduce the interaction between patch and package. To decrease electromagnetic coupling, a via hole structure is designed and analyzed. The meander line antenna achieved a bandwidth of 220 MHz with the center frequency at 2.4 GHz, a maximum gain of 2.2 d B, and a radiation efficiency about 90% over its operational frequency. The whole system, with a small size of 20.2 mm×6.1 mm×2.6 mm, can be easily realized by a standard LTCC process. This antenna-in-package system integrated with a meander line antenna was fabricated and the experimental results agreed with simulations well.