Curing mechanism of TDE-85/MeTHPA epoxy resin modified by polyurethane

作     者：李芝华 郑子樵 任冬燕 黄耀鹏 

作者机构：School of Materials Science and EngineeringCentral South University Department of Materials EngineeringMianyang Vocational and Technical College 

出 版 物：《Journal of Central South University of Technology》 (中南工业大学学报（英文版）)

年 卷 期：2007年第14卷第3期

页      面：296-300页

核心收录：

学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：Project(2003AA84ts04) supported by the National High-Tech Research and Development Program of China 

主　　题：polyurethane epoxy resin modification curing mechanism 

摘      要：Diglycidyl 4,5-epoxy tetrahydro phthalate/methyl tetrahydrophthalic anhydride （TDE-85/MeTHPA） epoxy resin modified by polyurethane （PU） was prepared with 1,4-butanediol （1,4-BDO）, trimethylol propane （TMP） and polyurethane prepolymer synthesized by polypropylene glycol and toluene diisocynate. Chemical reaction and curing mechanism of this system were discussed by incorporating the results of infra spectrum analysis. The results indicate that the epoxy polymeric network I is obtained by the curing reaction between TDE-85 and MeTHPA, while the PU polymeric network II is obtained by the chain-extended and crosslinking reaction between 1,4-BDO, TMP and polyurethane prepolymer（PUP）. The graft chemical bonds are formed between polymer networks I and II that therefore increase the degree of blend and compatibility between epoxy polymer and PU.