Microstructure and Strength of the TiB2 Cermet/TiAl Joint Diffusion Bonded with Ni Interlayer

作     者：Zhuoran LI Jicai FENG Jian CAO Yiyu QIAN 

作者机构：State Key Lab of Advanced Welding Production Technology Harbin Institute of Technology Harbin 150001 China State Key Lab of Advanced Welding Production Technology Harbin Institute of Technology Harbin 150001 China State Key Lab of Advanced Welding Production Technology Harbin Institute of Technology Harbin 150001 China State Key Lab of Advanced Welding Production Technology Harbin Institute of Technology Harbin 150001 China 

出 版 物：《Journal of Materials Science & Technology》 (材料科学技术（英文版）)

年 卷 期：2003年第19卷第z1期

页      面：181-183页

核心收录：

学科分类：08[工学] 080502[工学-材料学] 0805[工学-材料科学与工程（可授工学、理学学位）] 

基　　金：The work was supported by the National Natural Science Foundation of China (No. 50175021) 

主　　题：Microstructure, Strength, TiB2, TiAl 

摘      要：Vacuum diffusion bonding of TiB2 cermet to TiAl -based alloys using Ni interlayer has been carried out at 1123～1323 K for0.6～3.6 ks under 80 MPa. The effects of joining parameters on the microstructure of the joints and mechanical propertieswas investigated. The results showed that a TiAlNi2 intermetallic layer and two Ti, Al, Ni solid solution layers were formed atthe interface of Ni/TiAl. The shear strength was 110 MPa with bonding temperature at 1223 K, bonding time for 1.8 ks andbonding pressure under 80 MPa.