Progress in material removal mechanisms of surface polishing with ultra precision

作     者：XU Jin LUO Jianbin LU Xinchun ZHANG Chaohui PAN Guoshun 

作者机构：State Key Laboratory of TribologyTsinghua UniversityBeijing 100084China 

出 版 物：《Chinese Science Bulletin》 (CHINESE SCIENCE BULLETIN)

年 卷 期：2004年第49卷第16期

页      面：1687-1693页

核心收录：

学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 081201[工学-计算机系统结构] 0812[工学-计算机科学与技术（可授工学、理学学位）] 

基　　金：National Natural Science Foundation of China,NSFC: 50390060 National Key Research and Development Program of China,NKRDPC: 2003CB716201 

主　　题：化学机械抛光 CMP 物质迁移机理 磨损 ULSL 计算机硬盘 

摘      要：Chemical mechanical polishing (CMP) process is commonly regarded as the best method for achieving global planarization in the field of surface finishing with ultra-precision. The development of investigation on material removal mechanisms for different materials used in com-puter hard disk and ultra-large scale integration fabrication are reviewed here. The mechanisms underlying the interac-tion between the abrasive particles and polished surfaces during CMP are addressed, and some ways to investigate the polishing mechanisms are presented.