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A novel compensation method for polygonized mesa structures on(100) silicon substrate

A novel compensation method for polygonized mesa structures on(100) silicon substrate

作     者:张涵 李伟华 

作者机构:Key Laboratory of MEMS of the Ministry of Education Southeast University 

出 版 物:《Journal of Semiconductors》 (半导体学报(英文版))

年 卷 期:2010年第31卷第6期

页      面:16-21页

核心收录:

学科分类:080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术(可授工学、理学学位)] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程(可授工学、理学学位)] 080502[工学-材料学] 

主  题:(100) substrate compensation method polygonized mesa structure simulation result experimental result 

摘      要:A theoretical compensation method for polygonized mesa structures on(100) silicon substrate during the anisotropic etching process has been developed,which contains four stages as follows:prepare the information of the etching condition;predict the structure's undercutting profile;construct the topological structure of compensation patterns; and generate practical compensation patterns from the topological *** reasoning process is clearly stated,and detailed steps for the undercutting prediction and topological structure construction are *** are also drawn about the rules which must be obeyed during the pattern generation *** simulation and experimental results of some polygon structures are finally given to prove this method's validity and reliability.

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