Application of the Blister Test in Study of Epoxy Adhesive

作     者：Fei Xiong 

作者机构：Industrial Research Institute Swinburne (IRIS) Hawthorn Melbourne Australia Gintic Institute of Manufacturing Technology Singapore 63875 

出 版 物：《材料科学与工程学报》 (Journal of Materials Science and Engineering)

年 卷 期：2000年第20卷第Z2期

页      面：804-810页

核心收录：

学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

主　　题：blister test delamination debonding pre-creack adhesion 

摘      要：Shaft-loaded blister test technique is used as an effective quantitative tool to measure adhesion strength. Investigation on conductive adhesive was done by modified blister test. It is found that shaftloaded blister test can be a good solution for the debonding of thin film adhesion. The intrinsic stable interface debonding process has been proved an attractive alternative to the conventional adhesion measurement techniques. In our study, epoxy matrix adhesive was studied using blister test technique in comparison with the traditional test-lap shear test. Adhesion strength was studied as a function of surface treatment and the metallization of substrate. It was found that surface conditions of substrate have significant impact on adhesion behaviour. The oxidation of surface is responsible for the poor adhesion. Activating chemical treatment and Plasma cleaning on substrate surface has been found to be a way of dreamatically improving adhesion strength of electronic conductive adhesive.