Directional Solidification Velocity of Undercooled Cu_(70)Ni_(30) Alloy Melt

作     者：Research Notes JinfuLI Xueping ZHANG and Yaohe ZHOU Gencang YANG 

作者机构：School of Materials Science and EngineeringShanghai Jiao Tong UniversityShanghai 200030China State Key Laboratory of Solidification ProcessingNorthwestern Polytechnical University 

出 版 物：《Journal of Materials Science & Technology》 (材料科学技术（英文版）)

年 卷 期：2001年第17卷第5期

页      面：572-574页

核心收录：

学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：The authors are grateful to the National Natural Science Foundation of China for the financial support under grant No.59431011 

主　　题：Directional Solidification Velocity of Undercooled Cu Velocity Alloy Melt 

摘      要：The directional dendrite growth velocity in the Cu70Ni30 alloy melt undercooled by 90-185 K was measured by high speed cinematography, and compared with the calculated free dendrite growth velocity. It is found that at lower undercoolings the interaction between the adjacent directionally growing dendrites is weak, and there is not a marked difference between the velocity of the directionally growing dendrite and that of free dendrite. But with undercooling increasing, the interaction is enhanced due to the decrease of the primary arm spacing, which makes the velocity difference enlarge quickly.