Press-pack IGBTs for HVDC and FACTS

作     者：Robin Simpson Ashley Plumpton Michael Varley Charles Tonner Paul Taylor Xiaoping Dai 

作者机构：Dynex Semiconductor LimitedLincolnLN63LFUK 

出 版 物：《CSEE Journal of Power and Energy Systems》 (中国电机工程学会电力与能源系统学报（英文）)

年 卷 期：2017年第3卷第3期

页      面：302-310页

核心收录：

学科分类：0820[工学-石油与天然气工程] 080903[工学-微电子学与固体电子学] 0808[工学-电气工程] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

主　　题：Flexible AC transmission systems HVDC transmission insulated gate bipolar transistors press-pack IGBT STATCOM VSC 

摘      要：The popularity of insulated gate bipolar transistors(IGBTs)for use in high-voltage direct current(HVDC)transmission and flexible AC transmission systems(FACTS)is ***,for these applications wire-bond IGBT technology has a number of shortcomings,such as insufficient current ratings for the most powerful schemes,and inability to fail to ***-pack IGBT technology,conversely,offers increased current ratings,and an inherent short-circuit failure mode,making it a more attractive choice for HVDC and ***,the design and manufacture of these devices requires a comprehensive understanding of the unique technical challenges,which differ markedly from those for wirebond modules or traditional pressure contact *** challenges include providing a high degree of mechanical protection for the IGBT chip against normal operating ***,it is essential to achieve uniform contact pressure across each chip surface to ensure optimum *** achieve this,manufacturers have designed products that use rigid copper electrodes manufactured to tighter tolerances than for other pressure contact devices,such as thyristors,and products that use compliant electrodes,incorporating spring *** is in the advanced stages of development of press-pack IGBT technology with demonstrated robust solutions for the technical challenges outlined in this *** success has been achieved through the use of state-of-the-art simulations in conjunction with a long history of manufacturing expertise for bipolar and IGBT ***,multiple press-pack IGBT variants are currently undergoing evaluation tests prior to product release.