Design and fabrication of silicon-tessellated structures for monocentric imagers

作     者：Tao Wu Stephen S.Hamann Andrew C.Ceballos Chu-En Chang Olav Solgaard Roger T.Howe 

作者机构：Department of Electrical EngineeringStanford UniversityStanfordCA 94305USA 

出 版 物：《Microsystems & Nanoengineering》 (微系统与纳米工程（英文）)

年 卷 期：2016年第2卷第1期

页      面：213-221页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：Google ATAP 

主　　题：curved image plane monocentric imager photodiode recessed negative trench profile 

摘      要：Compared with conventional planar optical image sensors,a curved focal plane array can simplify the lens design and improve the field of *** this paper,we introduce the design and implementation of a segmented,hemispherical,CMOS-compatible silicon image plane for a 10-mm diameter spherical monocentric *** conform to the hemispherical focal plane of the lens,we use flexible gores that consist of arrays of spring-connected silicon *** functionality is demonstrated by assembling the 20-μm-thick silicon gores into a hemispherical test *** have also fabricated and tested a photodiode array on a siliconon-insulator substrate for use with the curved *** testing shows that the fabricated photodiodes achieve good performance;the hemispherical imager enables a compact 160°field of view camera with 80% fill factor using a single spherical lens.