Interface evolution of Cu-Ni-Si/Al-Mg-Si clad composite wires after annealing

作     者：Zhen Yang Xu-Jun Mi Xue Feng Hao-Feng Xie Li-Jun Peng Guo-Jie Huang Yan-Feng Li Xiang-Qian Yin Zhen Yang;Xu-Jun Mi;Xue Feng;Hao-Feng Xie;Li-Jun Peng;Guo-Jie Huang;Yan-Feng Li;Xiang-Qian Yin

作者机构：Key Laboratory of Nonferrous Metals and ProcessesGRIMAT Engineering Institute Co.LtdBeijing 101400China 

出 版 物：《Rare Metals》 (稀有金属（英文版）)

年 卷 期：2020年第39卷第12期

页      面：1419-1424页

核心收录：

学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：the National Key Research and Development Plan(No.2016YFB0301405) 

主　　题：Intermetallic compounds Clad composite wires Diffusion Activation energy 

摘      要：Interface micros tructures of Cu-Ni-Si/Al-MgSi clad composite wires during isothermal annealing from 623 to 773 K were *** composite wires were fabricated by a drawing *** evolution of intermetallic compounds(IMCs)was analyzed.A continuous IMCs layer forms only after annealing for 1 min,which may be due to more IMCs nucleation points generated by deep drawing *** consist of Al_(4)Cu_(9),AlCu and Al_(2)Cu identified by energy-dispersive spectroscopy(EDS)and transmission electron microscopy(TEM).The growth activation energies of total IMCs,Al_(2)Cu,AlCu and Al_(4)Cu_(9),are 98.8,69.4,101.3 and 137.1 kJ·mol^(-1),*** higher growth activation energy of Al_(4)Cu_(9)results in the higher growth rate under high ***,the average interdiffusion coefficient for each IMC calculated by Wagner method shows that interdiffusion in Al_(2)Cu and AlCu is more active than that in Al_(4)Cu_(9).The higher growth rate of Al_(4)Cu_(9)may be caused by the long concentration range.