A flexible electromagnetic interference shielding film coated with a hybrid solder-magnetic powder mixture on a PET substrate
作者机构：Metal 3D Printing Convergence Research TeamKorea Institute of Machinery and Materials156 Gajeongbuk-roYuseong-guDaejeon34103Republic of Korea Metal Powder DepartmentKorea Institute of Materials Science797 Changwon-daeroSeongsan-guChangwon-siGyeongsangnam-do51508Republic of Korea Digital Manufacturing Process GroupKorea Institute of Industrial Technology113e58 Seohaean-roSiheung-siGyeonggi-do15014Republic of Korea Department of Printed ElectronicsKorea Institute of Machinery and Materials156 Gajeongbuk-roYuseong-guDaejeon34103Republic of Korea Department of Mining and Materials EngineeringMcGill University3610 University StreetMontrealQuebecH3A 0C5Canada Mechanical EngineeringUniversity of New Brunswick15 Dineen DriveFrederictonNew BrunswickE3B 5A3Canada
出 版 物：《Journal of Materiomics》 (无机材料学学报（英文）)
年 卷 期：2018年第4卷第4期
页 面：390-401页
核心收录：
学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学]
基 金：This study was partially sup-ported by the Korea Institute of Materials Science(KIMS).This work was mainly supported by the National Research Council of Science&Technology(NST)grant(No CRC-15-03-KIMM)of the Ministry of Science ICTand Future Planning(MSIP)in the Korea government.This research was also supported by the Korea Institute of Industrial Technology(KTTECH)internal project(Grant No.P]A18350)
主 题：Flexible EMI shielding film PET substrate Solder arrays Magnetic particulates
摘 要：A flexible electromagnetic interference(EMI)shielding film was innovatively fabricated using both low melting temperature solder arrays and amorphous soft magnet particulates consolidated on a polyethylene terephthalate(PET)***,the IneSneBi solder arrays presented a low melting point of 99.4C,which enabled attachment to the heat-sensitive plastic substrate without any thermal damage,and a low electrical resistivity of 14.1 mU cm,making them very effective at interrupting EM ***,the solder arrays with a high thermal conductivity of 61.2 W/(m$K)at 298.15 K were also useful as a thermal conductor for a heat ***,the solder arrays provide efficient electrical and thermal channels for electron transport induced by abruptly or consistently created EM waves due to suddenly turning on and the long term operation of electronics,***,the Fe-based magnetic particulates were added and resulted in effective saturation magnetization of 161.1 emu/g,remanence of 2.9 emu/g,and coercivity of 12.5 G,thus were able to disturb the EM pathway because of their soft magnetic ***,the hybrid EMI shielding film with exceptionally high electrical and thermal conductivity and superior soft magnetic properties provided remarkable shielding effectiveness of 102.5 dB at 10.2 GHz.
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