Research on the influence of machining introduced sub-surface defects and residue stress upon the mechanical properties of single crystal copper

作     者：CHEN MingJun, XIAO GaoBo, CHEN JiaXuan & WU ChunYa Harbin Institute of Technology, Harbin 150001, China 

作者机构：1. Harbin Institute of Technology Harbin 150001 China 

出 版 物：《Science China(Technological Sciences)》 (中国科学（技术科学英文版）)

年 卷 期：2010年第53卷第12期

页      面：3161-3167页

核心收录：

学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 080201[工学-机械制造及其自动化] 

基　　金：supported by the National Natural Science Foundation of China (Grant No. 50935003) the National High Technology Research and Development Program of China (Grant No. 2009AA044305) 

主　　题：nanomachining deformation residue stress molecular dynamics dislocations 

摘      要：Large scale molecular dynamics simulations of nanomachining and stretching of single crystal copper are performed to analyze the machining process’ influence on the material’s mechanical properties. The simulation results show that the machining process will introduce interfacial defects inside the specimen and enhance the compressive stress beneath the surface. Gener- ally speaking, interfacial defects lead to the decrease of the strength limit, while residue compressive stress can enhance the elastic limit and even the strength limit. Various machining parameters are adopted to investigate their influence on the me- chanical behavior of machined specimen. Lower cutting speed and smaller cutting depth lead to less defects and greater residue compressive stress, which brings about better mechanical properties. The elastic limit increases by 36.8% under the cutting depth of 0.73 nm and decreases by 21.1% under the cutting depth of 1.46 nm. The strength limit increases by 7.7% under the cutting speed of 100 m/s and decreases by 28.2% under the cutting speed of 300 m/s.