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Calculation and experimental study on heating temperature field of super-high strength aluminum alloy thick plate

超高强铝合金厚板升温温度场的计算与试验研究(英文)

作     者:Shi-tong FAN Yun-lai DENG Jin ZHANG Xiao-bin GUO 范世通;邓运来;张劲;郭晓斌

作者机构:School of Materials Science and Engineering Central South University Changsha 410083 China State Key Laboratory of High Performance and Complex ManufacturingCentral South University Changsha 410083 China Light Alloy Research Institute Central South University Changsha 410083 China 

出 版 物:《Transactions of Nonferrous Metals Society of China》 (中国有色金属学报(英文版))

年 卷 期:2017年第27卷第11期

页      面:2415-2422页

核心收录:

学科分类:08[工学] 080502[工学-材料学] 0805[工学-材料科学与工程(可授工学、理学学位)] 

基  金:Project(2012CB619500)supported by the National Basic Research Program of China Project(51375503)supported by the National Natural Science Foundation of China Project(2016YFB0300901)supported by the Major State Research Program of China Project(2013A017)supported by the Bagui Scholars Program of Guangxi Zhuang Autonomous Region,China 

主  题:lumped parameter method surface heat transfer coefficient temperature field aluminum alloy thick plate 

摘      要:Stepped heating treatment has been applied to aluminum alloy thick plate to improve the mechanical performance and corrosion *** temperature control of the plate is the difficulty in engineering *** heating process,the calculation of surface heat transfer coefficient and the accurate temperature control method were studied based on measured heating temperature for the large-size thick *** results show that,the temperature difference between the surface and center of the thick plate is *** on the temperature uniformity,the surface heat transfer coefficient was calculated,and it is constant below300°C,but grows greatly over300°***,a lumped parameter method(LPM)was developed to predict the plate temperature.A stepped solution treatment was designed by using LPM,and verified by finite element method(FEM)and *** curves calculated by LPM and FEM agree well with the experimental data,and the LPM is more convenient in engineering application.

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