Design space of electrostatic chuck in etching chamber

作     者：孙钰淳 程嘉 路益嘉 侯悦民 季林红 

作者机构：State Key Laboratory of Tribology Department of Mechanical Engineering Tsinghua University 

出 版 物：《Journal of Semiconductors》 (半导体学报（英文版）)

年 卷 期：2015年第36卷第8期

页      面：94-100页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：supported by the Ministry of Science and Technology of China(No.2011ZX02403) the National Natural Science Foundation of China(No.51175284) 

主　　题：design space electrostatic chuck clamping force temperature control 

摘      要：One of the core semiconductor devices is the electrostatic chuck. It has been widely used in plasma- based and vacuum-based semiconductor processing. The electrostatic chuck plays an important role in adsorbing and cooling/heating wafers, and has technical advantages on non-edge exclusion, high reliability, wafer planarity, particles reduction and so on. This article extracts key design elements from the existing knowledge and techniques of electrostatic chuck by the method proposed by Paul and Beitz, and establishes a design space systematically. The design space is composed of working objects, working principles and working structures. The working objects in- volve electrostatic chuck components and materials, classifications, and relevant properties; the working principles involve clamping force, residual force, and temperature control; the working structures describe how to compose an electrostatic chuck and to fulfill the overall functions. The systematic design space exhibits the main issues during electrostatic chuck design. The design space will facilitate and inspire designers to improve the design quality and shorten the design time in the conceptual design.