Evolution of microstructure and texture in copper during repetitive extrusion-upsetting and subsequent annealing

作     者：Q.Chen D.Y.Shu J.Lin Y.Wu X.S.Xia S.H.Huang Z.D.Zhao O.V.Mishin G.L.Wu Q. Chen D.Y. Shu J. Lin Y. WU X.S. Xia S.H. Huang Z.D. Zhao O.V. Mishin G.L. Wu

作者机构：State Key Laboratory of Mechanical Transmission Chongqing University Chongqing 400044 China 

出 版 物：《Journal of Materials Science & Technology》 (材料科学技术（英文版）)

年 卷 期：2017年第33卷第7期

页      面：690-697页

核心收录：

学科分类：080503[工学-材料加工工程] 08[工学] 080502[工学-材料学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 080201[工学-机械制造及其自动化] 

基　　金：supported by the Chongqing Research Program of Basic Research and Frontier Technology (No. cstc2015jcyj BX0115) support of the “111” Project (B16007) by the Ministry of Education and the State Administration of Foreign Experts Affairs of China the National Natural Science Foundation of China (Nos. 51471039, 51421001) 

主　　题：Severe plastic deformation Repetitive extrusion upsetting Copper Deformation microstructure Texture Annealing 

摘      要：The evolution of the microstructure and texture in copper has been studied during repetitive extrusionupsetting（REU） to a total von Mises strain of 4.7 and during subsequent annealing at different temperatures. It is found that the texture is significantly altered by each deformation pass. A duplex 001 ＋ 111 fiber texture with an increased 111 component is observed after each extrusion pass,whereas the 110 fiber component dominates the texture after each upsetting pass. During REU, the microstructure is refined by deformation-induced boundaries. The average cell size after a total strain of 4.7 is measured to be ~0.3 μm. This refined microstructure is unstable at room temperature as is evident from the presence of a small number of recrystallized grains in the deformed matrix. Pronounced recrystallization took place during annealing at 200？C for 1 h with recrystallized grains developing predominantly in high misorientation regions. At 350？C the microstructure is fully recrystallized with an average grain size of only 2.3 μm and a very weak crystallographic texture. This REU-processed and subsequently annealed material is considered to be potentially suitable for using as a material for sputtering targets.