Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator

作     者：赵继聪 袁泉 王凤祥 阚骁 韩国威 孙玲 孙海燕 杨晋玲 杨富华 Ji-Cong Zhao;Quan Yuan;Feng-Xiang Wang;Xiao Kan;Guo-Wei Han;Ling Sun;Hai-Yan Sun;Jin-Ling Yang;Fu-Hua Yang;Institute of Semiconductors,Chinese Academy of Sciences;Jiangsu Key Laboratory of ASIC Design,Nantong University;State Key Laboratory of Transducer Technology;School of Electronic,Electrical,and Communication Engineering,University of Chinese Academy of Sciences

作者机构：Institute of SemiconductorsChinese Academy of Sciences Jiangsu Key Laboratory of ASIC DesignNantong University State Key Laboratory of Transducer Technology School of ElectronicElectricaland Communication EngineeringUniversity of Chinese Academy of Sciences 

出 版 物：《Chinese Physics B》 (中国物理B（英文版）)

年 卷 期：2017年第26卷第6期

页      面：119-123页

核心收录：

学科分类：080805[工学-电工理论与新技术] 080904[工学-电磁场与微波技术] 0808[工学-电气工程] 0809[工学-电子科学与技术（可授工学、理学学位）] 080202[工学-机械电子工程] 08[工学] 080401[工学-精密仪器及机械] 0804[工学-仪器科学与技术] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 0704[理学-天文学] 0811[工学-控制科学与工程] 

基　　金：supported by the National Natural Science Foundation of China(Grant Nos.61234007,61404136,and 61504130) the Fund from the Ministry of Science and Technology of China(Grant No.2013YQ16055103) the Key Research&Development Program of Jiangsu Province,China(Grant No.BE2016007-2) the Major Project of Natural Science Research of the Higher Education Institutions of Jiangsu Province,China(Grant No.16KJA510006) 

主　　题：3D packaging coupling noise Q-factor RF MEMS resonator 

摘      要：In this paper, we present a three-dimensional（3D） vacuum packaging technique at a wafer level for a radio frequency micro-electromechanical system（RF MEMS） resonator, in which low-loss silicon vias is used to transmit RF ***–Sn solder bonding is adopted to provide a vacuum encapsulation as well as electrical conductions. A RF model of the encapsulation cap is established to evaluate the parasitic effect of the packaging, which provides an effective design solution of 3D RF MEMS encapsulation. With the proposed packaging structure, the signal-to-background ratio（SBR） of 24 dB is achieved, as well as the quality factor（Q-factor） of the resonator increases from 8000 to 10400 after *** packaged resonator has a linear frequency–temperature（ f –T） characteristic in a temperature range between 0℃ and 100℃. And the package shows favorable long-term stability of the Q-factor over 200 days, which indicates that the package has excellent hermeticity. Furthermore, the average shear strength is measured to be 43.58 MPa among 10 samples.