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Electro-mechanical response of functionally graded beams with imperfectly integrated surface piezoelectric layers

Electro-mechanical response of functionally graded beams with imperfectly integrated surface piezoelectric layers

作     者:YAN Wei1 & CHEN Weiqiu1,2 1. Department of Civil Engineering, Zhejiang University, Hangzhou 310027, China 2. State Key Lab of CAD & CG, Zhejiang University, Hangzhou 310027, China 

作者机构:Department of Civil Engineering Zhejiang University Hangzhou China State Key Lab of CAD & CG Zhejiang University Hangzhou China 

出 版 物:《Science China(Physics,Mechanics & Astronomy)》 (中国科学:物理学、力学、天文学(英文版))

年 卷 期:2006年第49卷第5期

页      面:513-525页

核心收录:

学科分类:080801[工学-电机与电器] 0808[工学-电气工程] 08[工学] 0805[工学-材料科学与工程(可授工学、理学学位)] 080502[工学-材料学] 0704[理学-天文学] 

基  金:This work was supported by the National Natural Science Foundation of China (Grant Nos. 10432030 and 10372088) 

主  题:functionally graded beam piezoelectric layers Kelvin-Voigt model state-space method 

摘      要:The time-dependent behavior of a simply-supported functionally graded beam bonded with piezoelectric sensors and actuators is studied using the state-space method. The creep behavior of bonding adhesives between piezoelectric layers and beam is characterized by a Kelvin-Voigt viscoelastic model, which is practical in a high temperature circumstance. Both the host elastic functionally graded beam and the piezoelectric layers are orthotropic and in a state of plane stress, with the former being inhomogeneous along the thickness direction. A laminate model is employed to approximate the host beam. Moreover, the coupling effect between the elastic deformation and electric field in piezoelectric layers is considered. Results indicate that the viscoelastic property of interfacial adhesives has a significant effect on the function of bonded actuators and sensors with time elapsing.

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