Mechanical properties and microstructure of rolled and electrodeposited thin copper foil

作     者：Xiang-Qian Yin Li-Jun Peng Saif Kayani Lei Cheng Jian-Wei Wang Wei Xiao Li-Gen Wang Guo-Jie Huang 无

作者机构：State Key Laboratory of Nonferrous Metals & ProcessesGeneral Research Institute for Nonferrous Metals Metal Materials DivisionKorea Institute of Materials Science 

出 版 物：《Rare Metals》 (稀有金属（英文版）)

年 卷 期：2016年第35卷第12期

页      面：909-914页

核心收录：

学科分类：080503[工学-材料加工工程] 0806[工学-冶金工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 0703[理学-化学] 0802[工学-机械工程] 0702[理学-物理学] 080201[工学-机械制造及其自动化] 

基　　金：financially supported by the National Natural Science Foundation of China (No. 51344008) 

主　　题：Copper foil Rolling Electrodepositing Texture Substructure 

摘      要：Commercial grade rolled and electrodeposited copper foils from Japan and China were selected, and their mechanical properties and microstructure were investigated. It was observed that there are notable differences in fracture strength, elongation at break and hydrophilicity between rol- led and electrodeposited copper foils. The rolled copper foils have higher tensile strength, lower ductility and larger static contact angle than electrodeposited copper foils. The rolled copper foils contain a [^-fiber texture, and the electrodeposited copper foils have random crystalline orientations. It was also observed that the rolled foils have packed grains, and elec- trodeposited foils have equiaxial grains. The uniform fine grain size and a few substructures of Japanese electrode- posited foils are major reasons for their higher elongation.