Kinetics of electroless Ni-Cu-P deposits on silicon in a basic hypophosphite-type bath

作     者：Wei-Long Liu Shu-Huei Hsieh Wen-Jauh Chen 

作者机构：Department of Materials Science and Engineering Formosa University Huwei Yunlin 632 China Taipei Graduate School of Materials Science Yunlin University of Science and Technology Yunlin 640 China Taipei 

出 版 物：《International Journal of Minerals,Metallurgy and Materials》 (矿物冶金与材料学报（英文版）)

年 卷 期：2009年第16卷第2期

页      面：197-202页

核心收录：

学科分类：081702[工学-化学工艺] 0709[理学-地质学] 0819[工学-矿业工程] 08[工学] 0806[工学-冶金工程] 0817[工学-化学工程与技术] 0708[理学-地球物理学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0703[理学-化学] 0802[工学-机械工程] 080101[工学-一般力学与力学基础] 0801[工学-力学（可授工学、理学学位）] 0702[理学-物理学] 

主　　题：electroless deposition Ni-Cu-P silicon substrate kinetics activation energy 

摘      要：Electroless Ni-Cu-P deposits were deposited on the Si substrate in a basic hypophosphite-type plating bath. The effects of pH value and the metal source composition, Ni and Cu, in the plating bath on the kinetics of the Ni-Cu-P deposition were studied. The electroless Ni-Cu-P deposits were characterized by a scanning electron microscope, a transmission electron microscope, an energy dispersive X-ray spectroscope, and an X-ray diffractometer. The results showed that the pH value of the plating bath had no obvious effect on the morphology and composition of electroless Ni-Cu-P deposits. However, the composition of the metal source, Ni and Cu, in the plating bath had great effect on the kinetics of electroless Ni-Cu-P deposition.