Effects of complexing agents on acidic electroless nickel deposition

作     者：JIN Ying YU Hongying YANG Dejun SUN Dongbai JIN Yinga,YU Hongyingb,YANG Dejunb,and SUN Dongbaia a National Center for Materials Service Safety,University of Science and Technology Beijing,Beijing 100083,China b Corrosion and Protection Center,School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

作者机构：National Center for Materials Service Safety University of Science and Technology Beijing Beijing 100083 China Corrosion andProteetion Center School of Materials Science andEngineering University of Science and Technology Beijing Beij'ing 100083 China 

出 版 物：《Rare Metals》 (稀有金属（英文版）)

年 卷 期：2010年第29卷第4期

页      面：401-406页

核心收录：

学科分类：081702[工学-化学工艺] 08[工学] 0817[工学-化学工程与技术] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

主　　题：electroless nickel complexing agents electrochemical impedance spectrum reaction resistance pH value 

摘      要：Our previous study reported the influences of different complexing agents on electroless nickel （EN） by examining the properties of the deposits. In the present work, the effects of four common-used complexing agents on EN deposition rate and the stability of solution pH values were examined, either with an acetic pH buffer agent or absent of them. It is indicated that the pH buffeting effect of them is dominative when the EN solution is lack of the pH buffer. Under this situation, the EN deposition rate increases with the concentration of complexing agents increasing. The EN deposition rate decreases with fin＇ther adding the complexing agent when the solution already has enough pH buffer capability. Electrochemical impedance spectroscopy obtained during EN deposition illustrates that, in this case, the enhanced reaction resistance is the main reason for a lower deposition rate. However, the influence of polarization caused by mass transfer is not negligible at high complex ratio for sodium citrate and malic acid EN solutions.