COUPLING EFFECTS OF VOID SHAPE AND VOID SIZE ON THE GROWTH OF AN ELLIPTIC VOID IN A FIBER-REINFORCED HYPER-ELASTIC THIN PLATE

作     者：Jiusheng Ren Hanhai Li Changjun Cheng Xuegang Yuan 

作者机构：Department of MechanicsShanghai UniversityShanghai 200444China Shanghai Key Laboratory of Mechanics in Energy and Environment EngineeringShanghai 200444China College of ScienceDalian Nationalities UniversityDalian 116600China 

出 版 物：《Acta Mechanica Solida Sinica》 (固体力学学报（英文版）)

年 卷 期：2012年第25卷第3期

页      面：312-320页

核心收录：

学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 0802[工学-机械工程] 0701[理学-数学] 0801[工学-力学（可授工学、理学学位）] 080102[工学-固体力学] 0702[理学-物理学] 

基　　金：supported by the National Natural Science Foundation of China (Nos. 10772104 and 10872045) the Innovation Project of Shanghai Municipal Education Commission (No. 09YZ12) the Shanghai Leading Academic Discipline Project (No. S30106) 

主　　题：fiber reinforced hyper-elastic material rectangular thin plate with void void shapeand void size potential energy principle growth of void 

摘      要：The growth of a prolate or oblate elliptic micro-void in a fiber reinforced anisotropic incompressible hyper-elastic rectangular thin plate subjected to uniaxial extensions is studied within the framework of finite elasticity. Coupling effects of void shape and void size on the growth of the void are paid special attention to. The deformation function of the plate with an isolated elliptic void is given, which is expressed by two parameters to solve the differential equation. The solution is approximately obtained from the minimum potential energy principle. Deformation curves for the void with a wide range of void aspect ratios and the stress distributions on the surface of the void have been obtained by numerical computation. The growth behavior of the void and the characteristics of stress distributions on the surface of the void are captured. The combined effects of void size and void shape on the growth of the void in the thin plate are discussed. The maximum stresses for the void with different sizes and different void aspect ratios are compared.