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UV-Irradiation Cured Organic-inorganic Hybrid Nanocomposite Initiated by Ethoxysilane-modified Multifunctional Polymeric Photoinitiator through Sol-gel Process

UV-Irradiation Cured Organic-inorganic Hybrid Nanocomposite Initiated by Ethoxysilane-modified Multifunctional Polymeric Photoinitiator through Sol-gel Process

作     者:Hu, Lihua Shi, Wenfang 

作者机构:Chinese Academy of Sciences Key Laboratory of Soft Matter Chemistry Department of Polymer Science and Engineering University of Science and Technology of China Hefei Anhui 230026 China 

出 版 物:《Chinese Journal of Chemistry》 (中国化学(英文版))

年 卷 期:2011年第29卷第9期

页      面:1961-1968页

核心收录:

学科分类:08[工学] 0805[工学-材料科学与工程(可授工学、理学学位)] 080502[工学-材料学] 

基  金:Project supported by the National Natural Science Foundation of China (No. 50973100) 

主  题:polymer-matrix composites sol-gel process mechanical property UV-curing 

摘      要:The UV-cured organic-inorganic hybrid nanocomposite (nano-Si-m-PI) was prepared through the photopolymeri- zation of acrylic resin initiated by ethoxysilane-modified multifunctional oligomeric photoinitiator (Si-m-PI). The es- terification reaction of 2-hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone (Irgacure 2959) with thioglycolic acid, and the following addition reactions with dipentaerythritol hexaacrylate and then 3-aminopropyltriethoxysilane were carried out for preparing the Si-m-PI. The Si-m-PI exhibits the similar UV absorption and molar extinction coefficient with Irgacure 2959. The photoinitiating activity study by photo-DSC analysis showed that the Si-m-PI possesses high photopolymerization rate at the peak maximum (Rpax) and final unsaturation conversion (Pf) in the cured hybrid films. From the scanning electron microscope (SEM) observation, the SiO2 nanoparticles dispersed uniformly in the formed nano-Si-m-PI, whereas the aggregation of nanoparticals occurred in nano-Irg, which was prepared through the photopolymerization of acrylic resin initiated by Irgacure 2959. Moreover, compared with the UV-cured pure polymer and nano-Irg, the nano-Si-m-PI showed remarkably enhanced thermal stability and mechanical properties.

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