Characteristics of Amorphous Silicon Nitride Films Deposited by LF-PECVD from SiH_4/N_2
Characteristics of Amorphous Silicon Nitride Films Deposited by LF-PECVD from SiH_4/N_2作者机构:State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China Chengdu 610054 CHN
出 版 物:《Semiconductor Photonics and Technology》 (半导体光子学与技术(英文版))
年 卷 期:2009年第15卷第3期
页 面:145-148页
学科分类:080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术(可授工学、理学学位)] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程(可授工学、理学学位)] 080502[工学-材料学]
摘 要:Amorphous silicon nitride films were deposited by low-frequency plasma-enhanced chemical vapor deposition(LF-PECVD) using silane and nitrogen as precursors. Characteristics such as deposition rate, surface morphology, and chemical composition were measured by spectroscopic ellipsometry(SE), atomic force mieroscope(AFM) and x-ray photoelectron spectroscopy(XPS). It was shown that amorphous silicon nitride film could be prepared by LF-PECVD with good uniformity and even surface. The XPS result indicated that a small quantity of oxygen was involved in the sample, which was discussed in this paper.