Enhanced thermal constant B of diamond films for ultrahigh sensitivity negative temperature coefficient thermistors
具有高温度敏感常数B值的超高灵敏金刚石薄膜负温度系数热敏电阻器件作者机构:Gemmological InstituteChina University of GeosciencesWuhan 430074China Shenzhen Research InstituteChina University of GeosciencesShenzhen 518057China State Key Lab of New Ceramics and Fine ProcessingSchool of Materials Science and EngineeringTsinghua UniversityBeijing 100084China Southwest United Graduate SchoolKunming 650500China
出 版 物:《Science China Materials》 (中国科学(材料科学)(英文版))
年 卷 期:2024年第67卷第10期
页 面:3321-3329页
核心收录:
学科分类:080702[工学-热能工程] 08[工学] 0807[工学-动力工程及工程热物理]
基 金:supported by the Fundamental Research Funds for the Central Universities(CUG2106117) Hubei Jewelry Engineering Technology Research Center(CIGTXM03202301) Hubei Provincial Natural Science Foundation(20241350053) GuangDong Basic and Applied Basic Research Foundation(2023A1515110043)
主 题:polycrystalline diamond thermistors negative temperature coefficient hopping conduction grain boundary
摘 要:Negative temperature coefficient(NTC)thermistor plays a crucial role in science research and engineering applications for precise temperature *** great progress has been achieved in NTC materials,enhancing sensitivity and maintaining this high sensitivity along with linearity across extensive temperature ranges remain a significant *** this study,we introduce a diamondbased thermistor(DT)characterized by its outstanding sensitivity,swift response time,and broad temperature monitoring *** temperature constant B for this DT,measured from 30 to 300°C(B30/300),achieves an exceptional value of 8012 K,which notably exceeds the temperature sensing capabilities of previously reported NTC thermistors within this extensive ***,diamond’s unique thermal conductivity and stability significantly boost the response speed and durability of the DT,offering substantial advantages over traditional ceramic *** enhanced temperature-sensitive properties of the DT are attributed to the presence of impurity elements in polycrystalline *** analysis indicates a hopping conduction mechanism,likely involving C-H or C-N dipoles at the diamond grain *** study marks a significant leap forward in diamond thermistor technology and sheds light on the mechanisms of thermal active conduction in diamond materials.