MD Simulation of Diffusion Behaviors in Collision Welding Processes of Al-Cu, Al-Al, Cu-Cu
作者机构:School of Intelligent ManufacturingHunan First Normal UniversityChangsha410082China School of Physics and TechnologyCenter for Ion Beam ApplicationHubei Nuclear Solid Physics Key LaboratoryWuhan UniversityWuhan430072China
出 版 物:《Computers, Materials & Continua》 (计算机、材料和连续体(英文))
年 卷 期:2024年第79卷第6期
页 面:3455-3468页
核心收录:
学科分类:08[工学] 0805[工学-材料科学与工程(可授工学、理学学位)] 080502[工学-材料学] 0812[工学-计算机科学与技术(可授工学、理学学位)]
基 金:supported by the Scientific Research Project of Hunan Provincial Department of Education(22C0642)
主 题:Atomic diffusion behavior molecular dynamics collision welding
摘 要:To investigate the effects of material combinations and velocity conditions on atomic diffusion behavior near collision interfaces,this study simulates the atomic diffusion behavior near collision interfaces in Cu-Al,Al-Al and Cu-Cu combinations fabricated through collision welding using molecular dynamic(MD)*** atomic diffusion behaviors are compared between similar metal combinations(Al-Al,Cu-Cu)and dissimilar metal combinations(Al-Cu).By combining the simulation results and classical diffusion theory,the diffusion coefficients for similar and dissimilar metal material combinations under different velocity conditions are *** effects of material combinations and collision velocity on diffusion behaviors are also *** diffusion behaviors of dissimilar material combinations strongly depend on the transverse velocity,whereas those of the similar material combinations are more dependent on the longitudinal *** findings can provide guidance for optimizing welding parameters.