Effect of Temperature and Grain Boundary on Void Evolution in Irradiated Copper:A Phase-Field Study
作者机构:tate Key Laboratory of Solidification ProcessingNorthwestern Polytechnical UniversityXi’an710072China Science and Technology On Reactor Fuel and Materials LaboratoryNuclear Power Institute of ChinaChengdu610213China
出 版 物:《Acta Metallurgica Sinica(English Letters)》 (金属学报(英文版))
年 卷 期:2024年第37卷第9期
页 面:1621-1632页
核心收录:
学科分类:08[工学] 080502[工学-材料学] 0805[工学-材料科学与工程(可授工学、理学学位)]
基 金:supported by the National Natural Science Foundation of China(Grants No.51871183) supported by the Research Fund of the State Key Laboratory of Solidification Processing(NPU),China(Grant No.2020-TS-06)
主 题:Void evolution Phase-field method Temperature Grain boundary
摘 要:The continued existence of high-energy radiation in nuclear reactors at high temperatures results in the formation of radiation-induced voids,which will further lead to inevitable swellings of polycrystalline structural components and thus premature failures.A deep understanding of the effect of temperature and grain boundary on void evolution in irradiated copper is significant for preventing this kind of ***,the phase-field method was employed to study void evolution in irradiated copper under different temperatures and grain *** results show that,due to the different sensitivities of point defect production rate and vacancy diffusion rate to temperature changes,both the nucleation-growth rate and the coarsening rate during void evolution increase first and then decrease with increasing temperature;moreover,the nucleation mechanism exhibits site-saturated nucleation at low temperatures while continuous nucleation at high *** presence of grain boundary can accelerate the emergence of void because grain boundaries can absorb more interstitials than *** finer the grain size,the stronger inhibitory effect of grain boundaries on the growth rate of void,due to the formation of void denuded zone near grain *** high temperatures,the growth rate of void in fine grains is significantly reduced due to the increase of vacancy diffusion rate and the enhancement of sink effect of grain boundary on vacancy.