Cooperative enhancement of mechanical and tribological properties through tailoring TiN transition interface in boron nitride nanosheets reinforced copper composites

作     者：Zhong-Hua Li Liang Liu Xin You Jian-Hong Yi Rui Bao Ming-Yi Zhu Song Lu Jun-Jun Pai 

作者机构：Faculty of Materials Science and EngineeringKunming University of Science and Technology Key Laboratory of Advanced Materials of Yunnan ProvinceKunming University of Science and Technology 

出 版 物：《Rare Metals》 (稀有金属(英文版))

年 卷 期：2024年第43卷第10期

页      面：5202-5215页

核心收录：

学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：financially supported by Yunnan Fundamental Research Projects (No. 202301BE070001-007) 

主　　题：Boron nitride nanosheets Copper matrix composites Interface structure Mechanical and frictional properties 

摘      要：Strengthening interface bonding between boron nitride nanosheets(BNNS) and copper matrix is an essential prerequisite for exploiting a new generation of copper matrix composites(CMCs) with high strength and wear resistance. Herein, BNNS/Cu composites were fabricated by the powder metallurgy route, matrix-alloying(adding 1.0 wt% Ti) strategy was adopted to improve the interfacial wettability and strengthen interface adhesion. A typical sandwich-like multiply interface structure involving TiN transition layers, BNNS and Cu matrix had been well constructed through the rational heat treatment(900℃for 120 min). Additionally, nano-sized TiB whisker was in situ formed in the vicinity of the interface, it had linked the BNNS-Cu-TiN multiply interface, which played a role of threading the needle and significantly strengthened the multi-interfaces bonding. This specific interface structure was finely characterized, and the formation mechanism of solid-state interfacial reaction feature was proposed. The results demonstrated that the ultimate tensile strength(UTS) of BNNS/Cu-(Ti)-900℃ increased from 248 to 530 MPa(increased by 114%), and the coefficient of friction(COF) decreased from 0.51 to 0.28 than pure Cu. This work highlights the importance of interface configuration design, which contributes to the development of CMCs with prominent comprehensive properties.