Mechanism in Solidification of a Ternary Nickel Based Alloy

作     者：田密 成博 TIAN Mi;CHENG Bo

作者机构：School of Aeronautical Manufacturing IndustryChengdu Aeronautical PolytechnicChengdu 610100China College of Mechanical EngineeringNorth University of ChinaTaiyuan 030051China 

出 版 物：《Journal of Wuhan University of Technology(Materials Science)》 (武汉理工大学学报（材料科学英文版）)

年 卷 期：2024年第39卷第4期

页      面：1018-1024页

核心收录：

学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：Funded by the Natural Science Foundation of Shanxi Province(No.202203021211093) 

主　　题：undercooling recalescence Ni-Cu-Co ternary alloy grain refinement recrystallization 

摘      要：The experiment employed the use of melt purification and cyclic superheating technique to achieve maximum undercooling of Ni65Cu31Co4 alloy at ***,high-speed photography techniques were used to capture the process of alloy liquid phase interface migration,and analyzed the relationship between the shape characteristics of the front end of alloy solidification and *** microstructure of the alloy was observed through metallographic microscopy,and the micro-morphological characteristics and evolution of the rapidly solidified microstructure were systematically *** is found that the grain refinement mechanism of Ni-Cu-Co ternary alloy is similar to that of Ni-Cu binary *** refinement at low undercooling is caused by intense dendritic remelting,while grain refinement at high undercooling is attributed to recrystallization,driven by the stress and plastic strain accumulated from the interaction of liquid flow and primary dendrites caused by rapid *** also shows that the addition of the third element Co plays a significant role in solidification rate and re-ignition effect.