Co-enhancement of thermal conduction and radiation through morphologies controlling of graphene functional layer for chip thermal management

作     者：Shuting Cheng Kun Wang Shichen Xu Yi Cheng Ruojuan Liu Kewen Huang Hao Yuan Wenjuan Li Yuyao Yang Fushun Liang Fan Yang Kangyi Zheng Zhiwei Liang Ce Tu Mengxiong Liu Xiaomin Yang Jingnan Wang Xuzhao Gai Yuejie Zhao Xiaobai Wang Yue Qi Zhongfan Liu 

作者机构：State Key Laboratory of Heavy Oil ProcessingCollege of ScienceChina University of PetroleumBeijing 102249China Centre for NanochemistryBeijing Science and Engineering Centre for NanocarbonsBeijing National Laboratory for Molecular SciencesCollege of Chemistry and Molecular EngineeringPeking UniversityBeijing 100871China Beijing Graphene Institute(BGI)Beijing 100095China College of EnergySoochow Institute for Energy and Materials Innovations(SIEMIS)Jiangsu Provincial Key Laboratory for Advanced Carbon Materials and Wearable Energy TechnologiesSoochow UniversitySuzhou 215006China Department of ChemistryCollege of Chemistry and Materials EngineeringBeijing Technology and Business UniversityBeijing 100048China 

出 版 物：《Nano Research》 (纳米研究（英文版）)

年 卷 期：2024年第17卷第10期

页      面：8885-8892页

核心收录：

学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 0703[理学-化学] 0702[理学-物理学] 

基　　金：financially supported by the National Natural Science Foundation of China(Nos.52272032,T2188101,and 52021006) the Beijing Nova Program of Science and Technology(No.20220484079) 

主　　题：chip thermal management thermal conduction thermal radiation graphene morphology control 

摘      要：With the continuous advancements in electronics towards downsizing and integration,efficient thermal dissipation from chips has emerged as a critical factor affecting their lifespan and operational *** fan-less chip cooling system has two critical interfaces for thermal transport,which are the contact interface between the base and the chip dominated by thermal conduction,and the surface of the fins dominated by thermal *** different thermal transfer modes of these two critical interfaces pose different requirements for thermal management *** the study,a novel approach was proposed by developing graphene thermal transport functional material whose morphology could be intentionally designed via reformed plasmaenhanced chemical vapor deposition(PECVD)methods to meet the diverse requirements of heat transfer ***,graphene with multilevel branching structure of vertical graphene(BVG)was fabricated through the hydrogenassisted PECVD(H_(2)-PECVD)strategy,which contributed a high emissivity of~*** was deposited on the fins’surface and functioned as the radiation enhanced layer to facilitate the rapid radiation of heat from the heat sinks into the surrounding ***,the well-oriented vertical graphene(OVG)was successfully prepared through the vertical electric field-assisted PECVD process(EF-PECVD),which showed a high directional thermal conductivity of~53.5 W·m^(-1)·K^(-1).OVG was deposited on the contact interface and functioned as the thermal conduction enhanced layer,allowing for the quick transmission of heat from the chip to the heat *** this design concept,the two critical interfaces in the chip cooling system can be jointly enhanced,resulting in a remarkable cooling efficiency enhancement of~30.7%,demonstrating that this novel material possessed enormous potential for enhancing the performance of cooling ***,this research not only provided new design concepts for the cooling system