Effect of Co on Solidification Characteristics and Microstructural Transformation of Non-equilibrium Solidified Cu-Ni Alloys
作者机构:Materials Engineering Research GroupFaculty of EngineeringUniversity Malaysia Sabah88400 Kota KinabaluSabahMalaysia College of Mechanical and Electronic EngineeringHuanghe Jiaotong UniversityJiaozuo 454950China Henan Engineering Technology Research Center on Intelligent Manufacturing Technology and EquipmentJiaozuo 454950China Centre of Research in Energy and Advanced MaterialsFaculty of EngineeringUniversiti Malaysia SabahJalan UMS88400 Kota KinabaluSabahMalaysia Nano Engineering and Materials Research groupFaculty of EngineeringUniversity Malaysia Sabah88400 Kota KinabaluSabahMalaysia
出 版 物:《Journal of Wuhan University of Technology(Materials Science)》 (武汉理工大学学报(材料科学英文版))
年 卷 期:2024年第39卷第2期
页 面:444-453页
核心收录:
学科分类:08[工学] 080502[工学-材料学] 0805[工学-材料科学与工程(可授工学、理学学位)]
主 题:non-equilibrium solidification recalescence effect solidification character microstructure
摘 要:Non-equilibrium solidification structures of Cu55Ni45 and Cu55Ni43Co2 alloys were prepared by the molten glass purification cycle superheating *** variation of the recalescence phenomenon with the degree of undercooling in the rapid solidification process was investigated using an infrared *** addition of the Co element affected the evolution of the recalescence phenomenon in Cu-Ni *** images of the solid-liquid interface migration during the rapid solidification of supercooled melts were captured by using a high-speed *** solidification rate of Cu-Ni alloys,with the addition of Co elements,was ***,the grain refinement structure with low supercooling was characterised using electron backscatter diffraction(EBSD).The effect of Co on the microstructural evolution during nonequilibrium solidification of Cu-Ni alloys under conditions of small supercooling is investigated by comparing the microstructures of Cu55Ni45 and Cu55Ni43Co2 *** experimental results show that the addition of a small amount of Co weakens the recalescence behaviour of the Cu55Ni45 alloy and significantly reduces the thermal strain in the rapid solidification *** the rapid solidification phase,the thermal strain is greatly reduced,and there is a significant increase in the characteristic undercooling ***,the addition of Co and the reduction of Cu not only result in a lower solidification rate of the alloy,but also contribute to the homogenisation of the grain size.