Phase precipitation and corrosion properties of copper-bearing ferritic stainless steels by annealing process
作者机构：School of Metallurgy and EngineeringXi’an University of Architecture and TechnologyXi’an710055ShaanxiChina Shaanxi Special Equipment Inspection and Testing InstituteXi’an710048ShaanxiChina Jilin Railway Technology CollegeJilin132200JilinChina Stainless Steel Branch of Gansu Jiu Steel Group Hongxing Iron and Steel Co.Ltd.Jiayuguan735100GansuChina
出 版 物：《Journal of Iron and Steel Research(International)》 (钢铁研究学报（英文版）)
年 卷 期：2023年第30卷第11期
页 面：2280-2292页
核心收录：
学科分类：08[工学] 0804[工学-仪器科学与技术] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学]
基 金：support of this work by the National Natural Science Foundation of China(51774226) the Major Program of Science and Technology in Shanxi Province(No.20191102006).
主 题：430 stainless steel Annealing Cu-rich phase Pitting corrosion Passivation film
摘 要：The effects of different annealing processes on the phase precipitation behavior and corrosion properties of copper-bearing 430 ferritic stainless steel were systematically investigated.The shape,quantity and distribution of copper-rich precipitates by different annealing processes were characterized by scanning electron microscopy,transmission electron microscopy,backscatter electron and backscatter diffraction.The pitting resistance behavior in simulated physiological saline envi-ronments(0.9 wt.%NaCl)was investigated using electrochemical workstation and X-ray photoelectron spectroscopy.The results showed that the copper-rich phase prepared by repeated rolling and annealing gradually changed from long needle-like to short thick rod-like and granular,whose distribution tended to be uniform and diffusive,and the number of copper-rich phases increased.After solution/antibacterial annealing process,the size and density of the copper-rich phase increase,resulting in a discontinuity of the passivation film on the stainless steel,which reduces the pitting resistance to some extent.The refinement mechanism revealed that pre-deformation brings about a modification in both precipitation mechanism and growth kinetics of epsilon copper.
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