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Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging

作     者:Cheng-ming Li Shu-jin Chen Shan-shan Cai Ju-bo Peng Xiao-jing Wang Ying-wu Wang Cheng-ming Li;Shu-jin Chen;Shan-shan Cai;Ju-bo Peng;Xiao-jing Wang;Ying-wu Wang

作者机构:School of Material Science and EngineeringJiangsu University of Science and TechnologyZhenjiang 212003JiangsuChina R&D CenterYunnan Tin Group(Holding)Co.Ltd.Kunming 650000YunnanChina Modern School of EngineeringYunnan UniversityKunming 650091YunnanChina 

出 版 物:《Journal of Iron and Steel Research International》 (国际钢铁研究杂志)

年 卷 期:2023年第30卷第8期

页      面:1650-1660页

核心收录:

学科分类:08[工学] 080502[工学-材料学] 0805[工学-材料科学与工程(可授工学、理学学位)] 

基  金:support received from Yunnan Fundamental Research Projects(Grant No.202101BC070001-007) the Jiangsu Province Industry-University-Research Cooperation Project(No.BY2022832) the National Natural Science Foundation of China(No.52275339) 

主  题:SAC305 solder Mn doping Shear mechanical behavior Isothermal aging Interfacial intermetallic compound 

摘      要:The effects of Mn addition(0.005,0.01,0.03,0.05,and 0.07 wt.%)on microstructure,shear mechanical behavior,and interfacial thermal stabilities of SAC305 joints were investigated under isothermal aging temperatures of 170 C with different aging time(0,250,500,and 750 h).It is found that Mn addition can increase fracture energy of joints without decreasing the shear *** the microstructures have transformed from the eutectic net-like structure in SAC305 solder joints into the structures based onβ-Sn matrix with intermetallic compounds(IMCs)*** doping 0.07 wt.%Mn,the Cu_(6)Sn_(5) growth along the SAC305/Cu interface during thermal aging can be inhibited to some *** isothermal aging at 170°C,the maximum shear force of solder joint decreases continuously with aging time increasing,while the fracture energy rises first and then decreases,reaching the maximum at 500 h compared by that with the microstructure ***_(3)Sn growth between Cu_(3)Sn_(5)/Cu interface has been retarded most at the aging time of 250 h with 0.07 wt.%Mn-doped *** the aging time prolonging,the inhibition effect of Mn on CusSn IMC layer becomes *** strengthening effect of Mn can be explained by precipitation strengthening,and its mechanical behavior can be predicted by particle strengthening model proposed by Orowan.

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