Tailoring sintering-resistant thermal barrier coatings by considering critical healing width of two-dimensional interlamellar pores
作者机构：State Key Laboratory for Mechanical Behavior of MaterialsSchool of Materials Science and EngineeringXi'an Jiaotong UniversityXi'an 710049China
出 版 物：《Journal of Advanced Ceramics》 (先进陶瓷（英文）)
年 卷 期：2023年第12卷第7期
页 面：1317-1330页
核心收录：
学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学]
基 金：supported by the National Science and Technology Major Project(Grant No.2019-VII-0007-0147) the Young Elite Scientists Sponsorship Program by China Association for Science and Technology(CAST)(Grant No.YESS20200083) the Fundamental Research Funds for the Central Universities(Grant No.xzy012022057)
主 题：thermal barrier coatings(TBCs) air plasma spraying(APS) multiple connections grain growth sintering-resistant structure
摘 要：Large degradation in thermal insulation and strain tolerance is a main headache and a primary cause of the failure for plasma-sprayed thermal barrier coatings(TBCs)during *** mechanism behind such degradation is the healing of interlamellar pores formed by multiple connections between edges of a pore,which significantly speeds up healing during thermal *** objective of this study is to obtain sintering-resistant TBCs by tailoring the width of interlamellar pores to avoid multiple ***,the mechanism responsible for the multiple connections was *** splat surfaces before and after thermal treatments were characterized via an atomic force microscope(AFM).The roughening of the pore surface occurs during thermal exposure,along with the grain growth inside the ***,the local surface height increases,which causes multiple connections and healing of the interlamellar ***,critical widths of the interlamellar pores for avoiding the multiple connections during thermal exposure are established by correlating the extent of surface roughening with the growth of individual *** height increase of the splat surface and the growth of the grain size(D)were found to increase with the exposure temperature and duration.A relationship linking the height increase and the growth of the grain size induced by thermal exposure in plasma-sprayed ceramic splats was ***,composite TBCs were prepared to form wide interlamellar pores in the *** this design,the increases in the thermal conductivity(λ)and the elastic modulus(E)can be prevented to a large ***,sintering-resistant TBCs that maintain high thermal insulation and strain tolerance,even afer long thermal exposure,can be created.
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