Construction of all-organic low dielectric polyimide hybrids via synergistic effect between covalent organic framework and cross-linking structure

作     者：Wanjing Zhao Zhaoyang Wei Chonghao Lu Yizhang Tong Jingshu Huang Xianwu Cao Dean Shi Robert KYLi Wei Wu Wanjing Zhao;Zhaoyang Wei;Chonghao Lu;Yizhang Tong;Jingshu Huang;Xianwu Cao;Dean Shi;Robert K.Y.Li;Wei Wu

作者机构：Key Laboratory of Polymer Processing Engineering of Ministry of EducationGuangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced ManufacturingSchool of Mechanical and Automotive EngineeringSouth China University of TechnologyGuangzhou510640China Hubei Collaborative Innovation Center for Advanced Organic Chemical MaterialsMinistry of Education Key Laboratory for the Green Preparation and Application of Functional MaterialsHubei Key Laboratory of Polymer MaterialsFaculty of Materials Science and EngineeringHubei UniversityWuhan430062China Department of Materials Science and EngineeringCity University of Hong KongTat Chee AvenueKowloonHong Kong Special Administrative Region of China Jihua LaboratoryFoshan528200China 

出 版 物：《Nano Materials Science》 (纳米材料科学（英文版）)

年 卷 期：2023年第5卷第4期

页      面：429-438页

核心收录：

学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 0703[理学-化学] 

基　　金：supported by National Natural Science Foundation of China(52103029 and 51903075) 

主　　题：Polyimide Covalent organic framework All-organic Cross-linking structure Dielectric property Hybrid film 

摘      要：Polyimide(PI)is a promising electronic packaging material,but it remains challenging to obtain an all-organic PI hybrid film with decreased dielectric constant and loss without modifying the ***,a series of allorganic PI hybrid films were successfully prepared by introducing the covalent organic framework(COF),which could induce the formation of the cross-linking structure in the PI *** to the synergistic effects of the COF fillers and the cross-linking structure,the PI/COF hybrid film containing 2 wt%COF exhibited the lowest dielectric constant of 2.72 and the lowest dielectric loss(tanδ)of 0.0077 at 1 *** is attributed to the intrinsic low dielectric constant of COF and a large number of mesopores within the ***,the cross-linking network of PI prevents the molecular chains from stacking and improves the fraction of free volume(FFV).The molecular dynamics simulation results are well consistent with the dielectric properties ***,the PI/COF hybrid film with 5 wt%COF showed a significant enhancement in breakdown strength,which increased to 412.8 kV/mm as compared with pure *** addition,the PI/COF hybrid film achieve to reduce the dielectric constant and thermal expansion coefficient(CTE).It also exhibited excellent thermal,hydrophobicity,and mechanical *** all-organic PI/COF hybrid films have great commercial potential as next-generation electronic packaging materials.