Fundamental Research on Convective Heat Transfer in Electronic Cooling Technology

作     者：C.F.Ma Y.P.Can Y.Q.Tian D.H.Lei 

作者机构：Beijing Polytechnic UniversityBeijing 100022China 

出 版 物：《Journal of Thermal Science》 (热科学学报（英文版）)

年 卷 期：1992年第1卷第1期

页      面：30-40页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 080701[工学-工程热物理] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 0807[工学-动力工程及工程热物理] 

主　　题：convective heat transfer electronic cooling technology cooling modes. 

摘      要：During the past six years comprehensive research programs have been conducted at the Beijing Polytechnic University to provide a better understanding of heat transfer characteristics of existing and condidate cool- ing techniques for electronic and microelectronic *** paper provides a review and summary of the programs with emphasis on direct liquid *** in this review are the heat transfer investigations related to the following cooling modes:liquid free,mixed and forced convection,liquid jet impingement,flowing liquid film cooling,pool boiling,spray cooling,foreign gas jet impingement in liquid pool,and forced convection air-cooling.