Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration

作     者：Qilong Guan Chunjin Hang Shengli Li Dan Yu Ying Ding Xiuli Wang Yanhong Tian Qilong Guan;Chunjin Hang;Shengli Li;Dan Yu;Ying Ding;Xiuli Wang;Yanhong Tian

作者机构：State Key Laboratory of Advanced Welding and JoiningHarbin Institute of TechnologyHarbin 150001China Beijing Institute of Control EngineeringBeijing 100190China 

出 版 物：《Chinese Journal of Mechanical Engineering》 (中国机械工程学报（英文版）)

年 卷 期：2023年第36卷第2期

页      面：16-28页

核心收录：

学科分类：080503[工学-材料加工工程] 07[理学] 08[工学] 070104[理学-应用数学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 0825[工学-航空宇航科学与技术] 0701[理学-数学] 080201[工学-机械制造及其自动化] 

基　　金：Supported by National Natural Science Foundation of China (Grant No.51775141) Heilongjiang Touyan Innovation Team Program 

主　　题：Deep space exploration Extreme environments Solder joints Microstructure Electronics Reliability 

摘      要：The spacecraft for deep space exploration missions will face extreme environments,including cryogenic temperature,intense radiation,wide-range temperature variations and even the combination of conditions mentioned *** environments will lead to solder joints degradation or even failure,resulting in damage to onboard *** research activities on high reliability solder joints using in extreme environments can not only reduce the use of onboard protection devices,but effectively improve the overall reliability of spacecraft,which is of great significance to the aviation *** this paper,we review the reliability research on SnPb solder alloys,Sn-based lead-free solder alloys and In-based solder alloys in extreme environments,and try to provide some suggestions for the follow-up studies,which focus on solder joint reliability under extreme environments.