Transient analysis on surface heated piezoelectric semiconductor plate lying on rigid substrate

作     者：Luke ZHAO Sen GU Yaqin SONG Feng JIN Luke ZHAO;Sen GU;Yaqin SONG;Feng JIN

作者机构：State Key Laboratory for Strength and Vibration of Mechanical StructuresSchool of Aerospace EngineeringXi'an Jiaotong UniversityXi'an 710049China 

出 版 物：《Applied Mathematics and Mechanics(English Edition)》 (应用数学和力学（英文版）)

年 卷 期：2022年第43卷第12期

页      面：1841-1856页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：Project supported by the National Natural Science Foundation of China (Nos.12072253 and 62074125) 

主　　题：thermo-electro-elastic coupling piezoelectric semiconductor(PS) surface heating transient analysis 

摘      要：Based on the thermo-electro-elastic coupling theory,the mathematical model for a surface heated piezoelectric semiconductor(PS)plate is developed in the time *** the direct and inverse Laplace transformations to the established model,the mechanical and electrical responses are *** comparison between the analytical solution and the finite element method(FEM)is conducted,which illustrates the validity of the *** calculated results show that the maximum values of the mechanical and electrical fields appear at the heating ***,the perturbation carriers tend to concentrate in the zone near the heating surface under the given boundary *** can also be observed that the heating induced elastic wave leads to jumps for the electric potential and perturbation carrier density at the *** the thermal relaxation time is introduced,all the field quantities become smaller because of the thermal lagging ***,it can be found that the thermal relaxation time can describe the smooth variation at the jump ***,for a plate with P-N junction,the effect of the interface position on the electrical response is *** effects of the initial carrier density on the electrical properties are discussed in *** conclusions in this article can be the guidance for the design of PS devices serving in thermal environment.