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Fabrication and thermal conductivity of copper matrix composites reinforced by tungsten-coated carbon nanotubes

Fabrication and thermal conductivity of copper matrix composites reinforced by tungsten-coated carbon nanotubes

作     者:Jun-hui Nie Cheng-chang Jia XianJia Yi Li Ya-feng Zhang Xue-bing Liang 

作者机构:School of Materials Science and Engineering University of Science and Technology Beijing Beijing 100083 China China Iron & Steel Research Institute Group Beijing 100081 China 

出 版 物:《International Journal of Minerals,Metallurgy and Materials》 (矿物冶金与材料学报(英文版))

年 卷 期:2012年第19卷第5期

页      面:446-452页

核心收录:

学科分类:07[理学] 070205[理学-凝聚态物理] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程(可授工学、理学学位)] 080502[工学-材料学] 0702[理学-物理学] 

基  金:supported by the National High-Tech Research and Development Program of China (No.2009AA03Z116) the National Natural Science Foundation of China (No.50971020) 

主  题:metallic matrix composites (MMCs) carbon nanotubes tungsten copper spark plasma sintering thermal conductivity 

摘      要:Carbon nanotubes (CNTs) were coated by tungsten using metal organic chemical vapor deposition. Magnetic stirring was employed to disperse the W-coated CNTs (W-CNTs) in a Cu matrix, and then, the mixed powders were consolidated by spark plasma sintering. The W-CNTs obtained a uniform dispersion within the Cu matrix when the W-CNT content was less than 5.0vo1%, but high content of W-CNTs (10vol%) resulted in the presence of clusters. The W-CNT/Cu composites containing low content of W-CNTs (〈5.0vol%) exhibited a higher thermal conductivity than the sintered pure Cu, while the CNT/Cu composites exhibited no increase in thermal conductivity after the incorporation of uncoated CNTs. The W-CNT content was found to play a crucial role in determining the thermal conductivity of the W-CNT/Cu composites. The thermal conductivity of the W-CNT/Cu composites increased first and then decreased with the W-CNT content increasing. When the W-CNT content was 2.5vo1%, the W-CNT/Cu composite obtained the maximum value of thermal conductivity. The thermal resistance of the (W-CNT)-Cu interface was predicted in terms of Maxwell-Gamett effective medium approximation, and its calculated value was about 3.0× 10-9 m2.K.W-l.

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