Recent progress on thermal conductivity of graphene filled epoxy composites

作     者：Ruicong Lv Yanjuan Ren Haichang Guo Shulin Bai Ruicong Lv;Yanjuan Ren;Haichang Guo;Shulin Bai

作者机构：School of Materials Science and EngineeringHEDPS/Center for Applied Physics and TechnologyKey Laboratory of Polymer Chemistry and Physics of Ministry of EducationPeking UniversityBeijing100871China 

出 版 物：《Nano Materials Science》 (纳米材料科学（英文版）)

年 卷 期：2022年第4卷第3期

页      面：205-219页

核心收录：

学科分类：0821[工学-纺织科学与工程] 08[工学] 0817[工学-化学工程与技术] 0805[工学-材料科学与工程（可授工学、理学学位）] 0801[工学-力学（可授工学、理学学位）] 0702[理学-物理学] 

基　　金：supported by The National Key Research and Development Program of China (2020YFA0210704)。 

主　　题：Graphene Epoxy Composites Thermal conductivity 

摘      要：With the rapid development of the electronic industry, the requirements for packaging materials with high thermal conductivity(TC) are getting higher and higher. Epoxy is widely used as package material for electronic package applications. But it’s intrinsic TC can’t meets the increasing demands. Adding high TC graphene into epoxy matrix is a proper way to reinforce epoxy composites. This review focuses on the filler modification,preparation process and thermal properties of graphene-filled epoxy resin composites. Different ways of covalent and non-covalent modification methods are discussed. The various kinds of graphene coating layer are also summarized. Then we analysis the hybrid filler system in epoxy composite. We hope this review will provide guidance for the development and application of graphene-filled epoxy resin composites.