Fabrication of metal suspending nanostructures by nanoimprint lithography(NIL) and isotropic reactive ion etching(RIE)

作     者：XIE GuoYong ZHANG Jin ZHANG YongYi ZHANG YingYing ZHU Tao LIU ZhongFan 

作者机构：Center for Nanoscale Science and Technology(CNST)College of Chemistry and Molecular EngineeringPeking UniversityBeijing 100871China Nanotechnology Industrialization Base of ChinaTianjin 300457China 

出 版 物：《Science China(Technological Sciences)》 (中国科学（技术科学英文版）)

年 卷 期：2009年第52卷第5期

页      面：1181-1186页

核心收录：

学科分类：07[理学] 070205[理学-凝聚态物理] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0702[理学-物理学] 

基　　金：Supported by the National Natural Science Foundation of China (Grant No. 20573002) the Major State Basic Research Development Program of China (973Pprogram) (Grant No. 2001CB6105) 

主　　题：suspending nanostructure fabrication nanoimprint lithography(NIL) isotropic reactive ion etching(RIE) 

摘      要：We report herein a rational approach for fabricating metal suspending nanostructures by nanoimprint lithography(NIL) and isotropic reactive ion etching(RIE).The approach comprises three principal steps:(1) mold fabrication,(2) structure replication by NIL,and(3) suspending nanostructures creation by isotropic *** this approach,suspending nanostructures with Au,Au/Ti or Ti/Au bilayers,and Au/Ti/Au sandwiched structures are *** Au nanostructures,straight suspending nanostructures can be obtained when the thickness of Au film is up to 50 nm for nano-bridge and 90 nm for nano-finger *** the thickness of Au is below 50 nm for nano-bridge and 90 nm for nano-finger,the Au suspending nanostructures bend upward as a result of the mismatch of thermal expansion between the thin Au films and Si *** leads to residual stresses in the thin Au *** Au/Ti or Ti/Au bilayers nanostructures,the cantilevers bend toward Au film,since Au has a larger thermal expansion coefficient than that of *** in the case of sandwich structures,straight suspending nanostructures are obtained,this may be due to the balance of residual stress between the thin films.