EFFECTS OF Zn CONCENTRATION ON WETTABILITY OF Sn-Zn ALLOY ON Cu AND ON THE INTERFACIAL MICROSTRUCTURE BETWEEN Sn-Zn ALLOY AND Cu

作     者：H.Z. Huang X.Q. Wei L. Zhou X.D. Liu G.L. Guo 

作者机构：School of Materials Science and Engineering Nanchang University Nanchang 330047 China East China Institute of Technology Fuzhou 344000 China 

出 版 物：《Acta Metallurgica Sinica(English Letters)》 (金属学报（英文版）)

年 卷 期：2006年第19卷第4期

页      面：251-257页

核心收录：

学科分类：08[工学] 080502[工学-材料学] 0805[工学-材料科学与工程（可授工学、理学学位）] 

基　　金：Major Discipline Academic and Technical Leaders Training Program of Jiangxi Province  (2005008) 

主　　题：lead-free solder Sn-Zn alloy wettability interface intermetallic compound 

摘      要：The potential of using a hypoeutectic, instead of eutectic, Sn-Zn alloy as a lead-free solder has been discussed. The nonequilibrium melting behaviors of a series of Sn-Zn alloys were examined by differential thermal analysis. It was found that at a heating rate of 5℃/min, *** exhibited no melting range. Dipping and spreading tests were carried out to characterize the wettability of Sn-Zn alloys on Cu. Both tests exhibited that Sn-6.5Zn has significantly better wettability on Cu than Sn-9Zn. The reaction layers formed during the spreading tests were examined. When the Zn concentration fell between 2.5wt%-9wt%, two reaction layers were formed at the interface, a thick and flat Cu5Zn8 adjacent to Cu and a thin and irregular Cu-Zn-Sn layer adjacent to the alloy. Only a Cu0Sn5 layer was formed when the Zn concentration decreased to 0.5wt%. The total thickness of the reaction layer（s） between the alloy and Cu was found to increase linearly with the Zn concentration.