Interface evolution of TiAl/Ti6242 transient liquid phase joint using Ti, Cu foils as insert metals

作     者：段辉平 K.H.Bohm V.Ventzke M.Koak 

作者机构：School of Materials Science and Engineering Beijing University of Aeronautics and Astronautics Beijing 100083 China Institute for Materials Research GKSS Research Center Geesthacht Geesthacht D-21502 Germany 

出 版 物：《中国有色金属学会会刊：英文版》 (Transactions of Nonferrous Metals Society of China)

年 卷 期：2005年第15卷第2期

页      面：375-378页

核心收录：

学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 080201[工学-机械制造及其自动化] 

主　　题：铝钛合金 瞬态液相压焊 表面蒸气 机械性能 

摘      要：The interface evolution of TiAl/Ti6242 joint produced by transient liquid phase(TLP) bonding with Ti, Cu foils as insert metals was investigated. The results show that the surface oxide layer on TiAl plays a very important role in the formation process of the joint. A ‘bridge’ effect is observed because of the presence of the oxide layer on the surface of TiAl. The diffusion behavior of Cu atoms in TiAl is strongly controlled by the vacancies beneath the surface of TiAl. Based on the interface diffusion and interface wettability, a mechanism for the effect of bonding pressure, bonding temperature, holding time and stacking sequence of the insert foils on the joint formation process were proposed.