Preparation of Low-dielectric Permittivity Polyimide Resins with High Surface Activity from Chemically Bonded Hyperbranched Polysiloxane

作     者：Xiu-Ting Li Xiao-Meng Zhu Jie Dong Xin Zhao Qing-Hua Zhang Xiu-Ting Li;Xiao-Meng Zhu;Jie Dong;Xin Zhao;Qing-Hua Zhang

作者机构：State Key Laboratory for Modification of Chemical Fibers and Polymer MaterialsCollege of Materials Science and EngineeringDonghua UniversityShanghai 201620China 

出 版 物：《Chinese Journal of Polymer Science》 (高分子科学（英文版）)

年 卷 期：2021年第39卷第9期

页      面：1200-1210页

核心收录：

学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：This work was financially supported by the National Natural Science Foundation of China(Nos.51903038,21774019 and 21975040) the Program of Shanghai Academic Research Leader(No.18XD1400100) the Scientific Research Innovation Plan of Shanghai Education Commission(No.2019-01-07-00-03-E00001) the Fundamental Research Funds for the Central Universities and Graduate Innovation Fund of Donghua University(No.CUSF-DH-D-2019009) 

主　　题：Hyperbranched polysiloxane Polyimide resin Low dielectric constant Processability Bonding ability 

摘      要：Thermosetting resin matrix is the key component of advaneed wave-tra nsparent composites,where low dielectric constant,excellent processability,high thermal stability,as well as good bonding ability are required for ***,we prepared a series of phenylethynyl terminated polyimide(PI)resins by grafting amine-functi onalized hyperbra nched polysiloxane(HBPSi)to PI chains during the in situ *** effects of HBPSi on the processability of oligomers,molecular packing,thermal stability,dielectric property and bonding ability to reinforce Kevlar fibers of the cured PI/HBPSi composite resins have been examined in *** dielectric constants of the cured composite resins were greatly reduced from 3.29 to 2.19 without compromising its processability and thermal ***,the 10 wt%HBPSi-containing PI resin demonstrated better bonding ability to reinforce fibers with the in terfacial shear strength(IFSS)of 37.64 MPa,compared with that of neat PI-6 matrix(27.34 MPa),and better adhesion to metal with the lap shear strength of 10.48 MPa,50%higher than that of neat resin PI-6(6.98 MPa).These resultant PI/HBPSi composite resins exhibit excellent comprehensive properties,indicating their great potential as low-dielectric constant resin matrix in radar radome.