Bubble-templated Construction of Three-dimensional Ceramic Network for Enhanced Thermal Conductivity of Silicone Rubber Composites

作     者：Shou-Jun Li Jing-Chao Li Pei-ZhiJi Wen-Feng Zhang Yong-Lai Lu Li-Qun Zhang Shou-Jun Li;Jing-Chao Li;Pei-Zhi Ji;Wen-Feng Zhang;Yong-Lai Lu;Li-Qun Zhang

作者机构：State Key Laboratory of Organic-Inorganic CompositesBeijing University of Chemical TechnologyBeijing 100029China Beijing Key Laboratory of Wood Science and Engineering&MOE Key Laboratory of Wooden Material Science and ApplicationBeijing Forestry UniversityBeijing W0083China Key Laboratory of Carbon Fiber and Functional PolymersMinistry of EducationBeijing University of Chemical TechnologyBeijing 100029China Engineering Research Center of Elastomer Materials Energy Conservation and ResourcesMinistry of EducationBeijing University of Chemical TechnologyBeijing 100029China 

出 版 物：《Chinese Journal of Polymer Science》 (高分子科学（英文版）)

年 卷 期：2021年第39卷第7期

页      面：789-795页

核心收录：

学科分类：0817[工学-化学工程与技术] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 0703[理学-化学] 

基　　金：the financial support from the Joint Foundation of Ministry of Education for equipment pre-research(No.6141A020222XX) Post-doctoral Science Fund(No.2020M680405) 

主　　题：Thermally conductive network Alumina Curdlan Thermal conductivity 

摘      要：With the continuous development of the electronics industry,the energy density of modern electronic devices increases constantly,thus releasing a lot of heat during *** electronic devices take higher and higher request to the thermal interface *** high thermal conductivity needs to establish an interconnecting thermal conductivity network in the *** this purpose,the suspension of Al203 and curdlan was first foamed to construct a bubble-templated continuous ceramic *** to the rapid gelation property of curdlan,we can easily remove moisture by hot air ***,the high thermally conductive composites are prepared by vacuum impregnation of silicone *** result showed that composites prepared by our method have higher thermal conductivity than the samples obtained by traditional *** thermal conductivity of the prepared composite material reached 1.253 W·m^(-1)·K·^-(1)when the alumina content was 69.6 wt%.This facile method is expected to be applied to the preparation of high-performance thermal interface materials.