Integration of Power MOSFETs for Synchronous Buck Converters

作     者：Juan A. Herbsommer Jonathan Noquil Osvaldo Lopez David Jauregui 

作者机构：Power Stage Business Unit Texas Instruments Bethlehem 18015 PA USA 

出 版 物：《Journal of Energy and Power Engineering》 (能源与动力工程（美国大卫英文）)

年 卷 期：2012年第6卷第7期

页      面：1126-1130页

学科分类：080903[工学-微电子学与固体电子学] 080801[工学-电机与电器] 0808[工学-电气工程] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

主　　题：MOSFET synchronous buck converters integration DC/DC converters. 

摘      要：Efficiency and power loss in the microelectronic devices is a major issue in power electronics applications. The engineers are challenged every year to increase power density and at the same time reduce the amount of power dissipated in the applications to keep the maximum temperatures under specifications. This situation drives a constant demand for better efficiencies in smaller packages. Traditional approaches to improve efficiency in DC/DC synchronous buck converters include reducing conduction losses in the MOSFETs （metal oxide semiconductor field effect transistors） through lower RDS （ON） （resistance drain to source in the ON state） devices and lowering switching losses through low-frequency operation. However, the incremental improvements in RDS （ON） are at a point of diminishing returns and low RDS （ON） devices have large parasitic capacitances that do not facilitate the high-frequency operation required to improve power density. The drive for higher efficiency and increased power in smaller packages is being addressed by advancements in both silicon and packaging technologies. The NexFET power block combines these two technologies to achieve higher levels of performance, and in half the space versus discrete MOSFETs. This article explains these new technologies and highlights their performance advantage.