Modeling and Simulation of a Hybrid Jet-Impingement/Micro-Channel Heat Sink

作     者：Taidong Xu Hao Liu Dejun Zhang Yadong Li Xiaoming Zhou 

作者机构：Research Institute of CSICNanjing211153China University of Electronic Science and Technology of ChinaChengdu611731China 

出 版 物：《Fluid Dynamics & Materials Processing》 (流体力学与材料加工（英文）)

年 卷 期：2021年第17卷第1期

页      面：109-121页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 080502[工学-材料学] 

基　　金：National Natural Science Foundation of China(No.51676030,Zhou,X.M.,http://www.nsfc.gov.cn/) Sichuan Science and Technology Program(No.2019JDRC0026,Zhou,X.M.,http://scst.tccxfw.com/) 

主　　题：Jet impingement micro-channel heat sink numerical simulation orthogonal test 

摘      要：With the progressive increase in the number of transistors that can be accommodated on a single integrated circuit,new strategies are needed to extract heat from these devices in an efficient *** this regard methods based on the combination of the so-called“jet impingementand“micro-channelapproaches seem extremely promising for possible improvement and future applications in electronics as well as the aerospace and biomedical *** this paper,a hybrid heat sink based on these two technologies is analysed in the frame of an integrated *** CFD simulation of the coupled flow/temperature fields and orthogonal tests are performed in order to optimize the overall *** influence of different sets of structural parameters on the cooling performance is *** is shown that an optimal scheme exists for which favourable performance can be obtained in terms of hot spot temperature decrease and thermal uniformity improvement.