Behavior modeling on the PIM performance in connectors using FEA method and circuit simulation
Behavior modeling on the PIM performance in connectors using FEA method and circuit simulation作者机构:The 54th Research Institute of CETCShijiazhuang 050050China School of Information Science and TeehnologySouthwest Jiaotong UniversityChengdu 614202China School of Electronie EngineeringBeijing University of Posts and TelecommunicationsBeijing 100876China
出 版 物:《The Journal of China Universities of Posts and Telecommunications》 (中国邮电高校学报(英文版))
年 卷 期:2021年第28卷第1期
页 面:87-93页
核心收录:
学科分类:080801[工学-电机与电器] 0808[工学-电气工程] 08[工学] 0805[工学-材料科学与工程(可授工学、理学学位)] 080502[工学-材料学]
基 金:supported by the National Natural Science Foundation of China (62090012,62031016, 61831017) the Sichuan Provincial Science and Technology Important Projects (2019YFG0498, 2020YFG0282, 2020YFG0452 and 2020YFG0028)
主 题:passive intermodulation(PIM) finite element analysis(FEA) circuit model coaxial connector
摘 要:Coaxial connectors are generally regarded as a kind of potential passive non-linear source when magnetic materials are applied in the coating or under-plating, which may result in serious passive intermodulation(PIM) interference and degrade the communication quality. In this paper, the effect of connector coating materials on the PIM is theoretically studied using finite element analysis(FEA) and circuit simulations. Considering the material composition both in central and outer conductor, an FEA model of connector is proposed to identify the current density in magnetic material region. An equivalent circuit model expressing the nonlinearity in coating material is developed, coupled with the non-linear transfer model. The PIM product power of the connector with related material configuration is predicted by harmonic balance simulation. Intentionally design connector samples are used in PIM tests and the measurement results are consistent with the theoretical predictions. The PIM performance in coaxial connectors is demonstrated from the perspectives of both modeling analysis and experimental investigations.